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Important Update

The Asian Modelica Conference 2022 has been changed to a hybrid event on November 24–25, 2022. It is organized by Modelica Association in cooperation with Sophia University and Modelon K.K.. The conference period keeps the same as before of two days, while a conference venue will be available inside Yotsuya campus of Sophia University Tokyo, Japan. Some other updates are:

About the Conference

The Modelica Conference is the main event for users, library developers, tool vendors and language designers to share their knowledge and learn about the latest scientific and industrial progress related to all of the system simulation standards developed and maintained by the Modelica Association, in particular Modelica, the Functional Mockup Interface (FMI), the System Structure and Parameterization (SSP) standard and the The Distributed Co-simulation Protocol (DCP) standard and the Functional Mock-up Interface for embedded systems (eFMI) standard.

The program will cover modeling of complex physical and cyber-physical systems, as well as tools, for a wide range of research and industrial applications. More details about the virtual conference platform will be available soon.

We are looking forward to seeing you online or in-person.

Scope of the Conference

Modelica is a freely available, equation-based, object-oriented language for convenient and efficient modeling of complex, multi-domain cyber-physical systems described by ordinary differential, difference and algebraic equations. The Modelica language and the companion Modelica Standard Library have been utilized in demanding industrial applications, including full vehicle dynamics, power systems, robotics, hardware-in-the-loop simulations and embedded control systems, etc. The Functional Mockup Interface (FMI) is an open standard for the tool-independent exchange of models and for co-simulation. It is supported by many Modelica and non-Modelica tools and is the key to utilizing Modelica models in non-Modelica environments.

The Modelica conference will bring together people using any of the Modelica Association standards for modeling, simulation, and control applications, Modelica language designers, Modelica and/or FMI tool vendors and Modelica library developers. It provides Modelica users the opportunity to stay informed about the latest standards, library, and tool developments, and to get in touch with people working on similar modeling problems. The conference will cover topics such as the following:

In addition, the conference will include Vendors’ exhibition, by either virtual or physical means.

Call for Papers

You are encouraged to share your Modelica, FMI and other Modelica Association related work by submitting a paper in English. Papers and extended abstracts for presentations can be submitted via the EasyChair conference management system (login is needed first):

EasyChair AsianModelicaConference 2022

There, you can also read your reviews and hand in the final paper after the reviewing process has taken place. In order to submit a paper, you need to have an EasyChair account. Simply follow the provided instructions to create an account. The same account can be used for several conferences over several years. Once you have logged in, please choose option “enter as an author”. You can download the submission templates through easychair or here (abstract, paper), or upload your contribution in the section: “New submissions”. Simply follow the instructions.

The paper submission form includes the option to mark suitable topics for your paper. Please use this feature since it helps us to find suitable reviewers for your paper. Furthermore, there is the option to attach a .zip file to your paper. In this way, you can provide example models that correspond to your paper. The conference proceedings will be published by the Modelica Association on its website and by Linköping University Electronic Press. Each paper will be individually referenced by a DOI.

Exhibition and Sponsorship

To support the conference, and to get an opportunity to expose their Modelica- and/or FMI-related products and services, vendors will have the opportunity to sponsor the event and to participate in the exhibition. The sponsorship and exhibition will be avialable at the virtual conference as well.

A decision about the acceptance of sponsors and exhibitors will be based upon Modelica/FMI relevance of products and/or services at the time of application submission.

Important Dates (further extended)

Registration

Please register the hybrid conference according to your situation: either virtual or physical, general participant or presenter. The early bird ticket in Japanese Yen is available from August 23 to October 23, 2022. In the registration, you will be asked to fill in the form about your information. Please make sure you have consent to the Privacy Policy.

If you plan to attend the virtual conference, please register from the link below.

If you plan to attend the physical conference, please register from the link below. Conference dinner fee is included in the ticket.

For the presenter of the conference paper, please register from the link below. Conference dinner fee is included in the ticket for physical conference attendee.

Conference venue

The top floor classroom of Building No.7 at Yotsuya campus, Sophia University will be the main conference venue. The address is 7-1 Kioicho, Chiyoda-ku, Tokyo 102-8554 JAPAN.

You can access the North Gate of the campus through JR Chuo line, Marunouchi subway line, Nanboku subway line / 5 minutes from Yotsuya Station.

Please refer to the access map for more details.

Whova platform

Remote access to the virtual conference is managed using Whova. The participants who registered will receive an email from Whova. You will be notified once the event is ready on the Whova Web and Mobile apps. You will then be able to access the agenda and network with other attendees.

Organization and Contact

The conference is organized by Modelica Association in cooperation with Prof. Tielong Shen from Sophia University and Modelon K.K.. For more information and application, please contact the organizer.

Conference Board

Local Organization

Privacy Policy & Release Form

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